Numerical predictions of 3D power-supply on chip taking into considerations of proximity effect

3D Power-SoC (Supply on Chip), which can ultimately miniaturize the power supply, is attracted attentions. It integrates Si-LSIs, power devices and passive elements on a single chip. 3D Power-SoC requires frequencies above 30MHz. In addition, it realizes a very high power density, however handling power is small because of miniaturization. Therefore, parallel connection is required to increase the power handing capacity. Therefore, it is necessary to consider the proximity effect of the spiral inductor when the power supplies connected in parallel. In this paper, we report the proximity effect of the inductor through simulations.