{"title":"数据驱动的超导逻辑故障模型开发","authors":"Mingye Li, Fangzhou Wang, S. Gupta","doi":"10.1109/ITC44778.2020.9325220","DOIUrl":null,"url":null,"abstract":"Superconducting technology is being seriously explored for certain applications. We propose a new clean-slate method to derive fault models from large numbers of simulation results. For this technology, our method identifies completely new fault models – overflow, pulse-escape, and pattern-sensitive – in addition to the well-known stuck-at faults.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Data-driven fault model development for superconducting logic\",\"authors\":\"Mingye Li, Fangzhou Wang, S. Gupta\",\"doi\":\"10.1109/ITC44778.2020.9325220\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Superconducting technology is being seriously explored for certain applications. We propose a new clean-slate method to derive fault models from large numbers of simulation results. For this technology, our method identifies completely new fault models – overflow, pulse-escape, and pattern-sensitive – in addition to the well-known stuck-at faults.\",\"PeriodicalId\":251504,\"journal\":{\"name\":\"2020 IEEE International Test Conference (ITC)\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE International Test Conference (ITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITC44778.2020.9325220\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Test Conference (ITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITC44778.2020.9325220","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Data-driven fault model development for superconducting logic
Superconducting technology is being seriously explored for certain applications. We propose a new clean-slate method to derive fault models from large numbers of simulation results. For this technology, our method identifies completely new fault models – overflow, pulse-escape, and pattern-sensitive – in addition to the well-known stuck-at faults.