国家项目3D-IC技术研发

2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) Pub Date : 2022-11-28 DOI:10.1109/IMFEDK56875.2022.9975437

K. Kikuchi

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引用次数: 0

摘要

三维集成电路(3D-IC)技术是开发新一代电子器件的重要集成技术之一。我们通过国家项目展示3d集成电路技术的研发，为未来的人工智能、物联网和大数据时代做出贡献。

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R&D of 3D-IC Technology through National Projects

Three-dimensional integrated circuit (3D-IC) technology is one of the most important integration technologies for developing the new generation of electronic devices. We reveal the research and development of 3D-IC technology contributing to the future era of AI, IoT, and big data through national projects.

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来源期刊

2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)

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