B. R. Livesay, N. E. Donlin, A. K. Garrison, H. Harris, J. Hubbard
{"title":"基于位错的电迁移机制","authors":"B. R. Livesay, N. E. Donlin, A. K. Garrison, H. Harris, J. Hubbard","doi":"10.1109/RELPHY.1992.187649","DOIUrl":null,"url":null,"abstract":"The role of dislocation dynamics in electromigration degradation is presented based on both theoretical models and experimental data. Interactions between high current densities and dislocations were studied using micromechanics measurements, in situ scanning electron microscopy, and transmission electron microscopy, microstructural studies and calculations of dislocation interaction phenomena. Correlations between thin-film strengthening, electroplasticity, dislocation observations, and the crystallography of whiskers are presented.<<ETX>>","PeriodicalId":154383,"journal":{"name":"30th Annual Proceedings Reliability Physics 1992","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Dislocation based mechanisms in electromigration\",\"authors\":\"B. R. Livesay, N. E. Donlin, A. K. Garrison, H. Harris, J. Hubbard\",\"doi\":\"10.1109/RELPHY.1992.187649\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The role of dislocation dynamics in electromigration degradation is presented based on both theoretical models and experimental data. Interactions between high current densities and dislocations were studied using micromechanics measurements, in situ scanning electron microscopy, and transmission electron microscopy, microstructural studies and calculations of dislocation interaction phenomena. Correlations between thin-film strengthening, electroplasticity, dislocation observations, and the crystallography of whiskers are presented.<<ETX>>\",\"PeriodicalId\":154383,\"journal\":{\"name\":\"30th Annual Proceedings Reliability Physics 1992\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"30th Annual Proceedings Reliability Physics 1992\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1992.187649\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"30th Annual Proceedings Reliability Physics 1992","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1992.187649","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The role of dislocation dynamics in electromigration degradation is presented based on both theoretical models and experimental data. Interactions between high current densities and dislocations were studied using micromechanics measurements, in situ scanning electron microscopy, and transmission electron microscopy, microstructural studies and calculations of dislocation interaction phenomena. Correlations between thin-film strengthening, electroplasticity, dislocation observations, and the crystallography of whiskers are presented.<>
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