{"title":"回流焊过程中封装裂纹的x射线分析","authors":"M. Harada, S. Tanigawa, S. Ohizumi, K. Ikemura","doi":"10.1109/RELPHY.1992.187644","DOIUrl":null,"url":null,"abstract":"A new X-ray system tests cracking in QFP (quad flat pack) and SOJ, (small outline J-leaded pack) packages. It has been found that package cracking starts in two regions of delamination: (1) between the die pad and the chip, in the case of newly developed resins; and (2) between the die pad and the resin, in the case of older forms of resin. During experimentation, it was found that cracking in SOJ related to the newer resin is caused by vaporization of moisture in the materials attached to the die pad. This was verified through simulation.<<ETX>>","PeriodicalId":154383,"journal":{"name":"30th Annual Proceedings Reliability Physics 1992","volume":"176 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"X-ray analysis of the package cracking during reflow soldering\",\"authors\":\"M. Harada, S. Tanigawa, S. Ohizumi, K. Ikemura\",\"doi\":\"10.1109/RELPHY.1992.187644\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new X-ray system tests cracking in QFP (quad flat pack) and SOJ, (small outline J-leaded pack) packages. It has been found that package cracking starts in two regions of delamination: (1) between the die pad and the chip, in the case of newly developed resins; and (2) between the die pad and the resin, in the case of older forms of resin. During experimentation, it was found that cracking in SOJ related to the newer resin is caused by vaporization of moisture in the materials attached to the die pad. This was verified through simulation.<<ETX>>\",\"PeriodicalId\":154383,\"journal\":{\"name\":\"30th Annual Proceedings Reliability Physics 1992\",\"volume\":\"176 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"30th Annual Proceedings Reliability Physics 1992\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1992.187644\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"30th Annual Proceedings Reliability Physics 1992","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1992.187644","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
X-ray analysis of the package cracking during reflow soldering
A new X-ray system tests cracking in QFP (quad flat pack) and SOJ, (small outline J-leaded pack) packages. It has been found that package cracking starts in two regions of delamination: (1) between the die pad and the chip, in the case of newly developed resins; and (2) between the die pad and the resin, in the case of older forms of resin. During experimentation, it was found that cracking in SOJ related to the newer resin is caused by vaporization of moisture in the materials attached to the die pad. This was verified through simulation.<>
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