深度个位数节点系统设计技术协同优化的整体方法

S. S. Song, Gaurav Gupta, Ying-Hao Hsieh, Chun Cheng, S. Ekbote, N. Stevens-Yu, David Greenlaw, Steve Molloy
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引用次数: 0

摘要

工艺技术的日益复杂和对计算的需求导致芯片成本不可持续,性能和功率的边际改进。SDTCO(系统设计技术协同优化)的提出是为了解决这个成本和性能问题。本文回顾了改善PPACt(功率性能区域成本和上市时间)的关键SDTCO因素,涵盖了MOL(中线)和BEOL(后端)过程中不同因素和关键绩效指标之间的新过程和相互关系。需要从单元工艺到系统级KPI(关键绩效指标)的整体SDTCO评估和优化方法,以实现可持续的每晶体管成本缩放和合理的功率和性能改进。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Holistic Approach to System Design Technology Co-Optimization for Deep Single Digit Nodes
The increasing complexity of process technology and demand for computing have led to unsustainable chip costs with marginal performance and power improvement. SDTCO (System Design Technology Co-Optimization) is proposed to address this cost and performance issues. This paper reviews the key SDTCO knobs to improve the PPACt (Power Performance Area Cost and Time-to-market), covering the novel processes and interrelationships between different knobs and key performance indicators in MOL (Middle of Line) and BEOL (Back End of Line) process. Holistic SDTCO evaluation and optimization methods taking from unit process to system level KPI (Key Performance Index) are needed for sustainable cost per transistor scaling and reasonable power and performance improvement.
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