新型序贯等离子体活化法直接玻璃键合

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947418

Ran He, A. Yamauchi, T. Suga

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引用次数: 2

摘要

我们报道了一种新开发的连续等离子体激活键合(SPAB)工艺，用于石英玻璃晶圆之间的直接键合。本文提出的新型SPAB方法采用RIE N2等离子体活化后或取代O2等离子体活化后再进行N自由基活化。对实验结果进行了报道和讨论，并与传统的SPAB工艺进行了比较。

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Novel sequential plasma activation method for direct glass bonding

We report a newly developed sequential plasma activation bonding (SPAB) process for direct bonding between quartz glass wafers. The novel SPAB method in the present paper employed RIE N2 plasma activation followed by or instead of the O2 plasma activation before the N radical activation. Experimental results are reported and discussed with comparison with the conventional SPAB process.

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来源期刊

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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