{"title":"扇出晶圆级封装中的毫米波谐振器和后腔槽天线","authors":"C. Zihao, Lim Teck Guan","doi":"10.1109/EPTC.2018.8654410","DOIUrl":null,"url":null,"abstract":"In this paper, a 77 GHz reconstitute resonator without TMV is integrated in fan-out wafer level packaging (FOWLP) with mold first process. The resonator is pre-fabricated with a high dielectric constant and low tangent loss dielectric material to achieve small volume and high Q. The side walls of the resonator are plated with copper. The resonator is embedded in the molding compound and RDLs are used to connect the chip and resonator. A Q-factor of 354.4 is achieved. A small form factor and self-shielding cavity-back slot antenna is proposed based on reconstitute resonator. The fractional bandwidth is 1.89% at 79 GHz and the maximal antenna gain is 5 dBi.","PeriodicalId":360239,"journal":{"name":"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)","volume":"32 3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Millimeter wave resonator and cavity-back slot antenna in Fan-Out Wafer Level Packaging\",\"authors\":\"C. Zihao, Lim Teck Guan\",\"doi\":\"10.1109/EPTC.2018.8654410\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a 77 GHz reconstitute resonator without TMV is integrated in fan-out wafer level packaging (FOWLP) with mold first process. The resonator is pre-fabricated with a high dielectric constant and low tangent loss dielectric material to achieve small volume and high Q. The side walls of the resonator are plated with copper. The resonator is embedded in the molding compound and RDLs are used to connect the chip and resonator. A Q-factor of 354.4 is achieved. A small form factor and self-shielding cavity-back slot antenna is proposed based on reconstitute resonator. The fractional bandwidth is 1.89% at 79 GHz and the maximal antenna gain is 5 dBi.\",\"PeriodicalId\":360239,\"journal\":{\"name\":\"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"32 3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2018.8654410\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2018.8654410","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Millimeter wave resonator and cavity-back slot antenna in Fan-Out Wafer Level Packaging
In this paper, a 77 GHz reconstitute resonator without TMV is integrated in fan-out wafer level packaging (FOWLP) with mold first process. The resonator is pre-fabricated with a high dielectric constant and low tangent loss dielectric material to achieve small volume and high Q. The side walls of the resonator are plated with copper. The resonator is embedded in the molding compound and RDLs are used to connect the chip and resonator. A Q-factor of 354.4 is achieved. A small form factor and self-shielding cavity-back slot antenna is proposed based on reconstitute resonator. The fractional bandwidth is 1.89% at 79 GHz and the maximal antenna gain is 5 dBi.
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