{"title":"在PCB上跟踪错配余量多少才够?","authors":"Cong Gao, Pravin Patel","doi":"10.1109/EPEPS.2015.7347154","DOIUrl":null,"url":null,"abstract":"For high speed interconnect design, trace crosstalk due to trace mis-registration can be as high as connector and vias. One should make sure such crosstalk is well managed. This paper presents the parametric study on trace crosstalk with respect to the mis-registration margin and provides some guidelines in practical system designs.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"160 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Trace mis-registration margin on PCB how much is enough?\",\"authors\":\"Cong Gao, Pravin Patel\",\"doi\":\"10.1109/EPEPS.2015.7347154\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"For high speed interconnect design, trace crosstalk due to trace mis-registration can be as high as connector and vias. One should make sure such crosstalk is well managed. This paper presents the parametric study on trace crosstalk with respect to the mis-registration margin and provides some guidelines in practical system designs.\",\"PeriodicalId\":130864,\"journal\":{\"name\":\"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"volume\":\"160 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2015.7347154\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2015.7347154","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Trace mis-registration margin on PCB how much is enough?
For high speed interconnect design, trace crosstalk due to trace mis-registration can be as high as connector and vias. One should make sure such crosstalk is well managed. This paper presents the parametric study on trace crosstalk with respect to the mis-registration margin and provides some guidelines in practical system designs.