高性能FBGA组件焊点可靠性仿真模型开发

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI:10.1109/STHERM.2004.1291338

H. Qi, Mikyoung Lee, M. Osterman, Kyujin Lee, Seyong Oh, T. Schmidt

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引用次数: 7

摘要

从可靠性的角度出发，通过实验和失效物理分析，对新型细间距塑料球栅阵列进行了研究。在本研究中，建立了三维有限元模型来了解循环热加载环境下FBGA的热力学行为。通过实验测量，利用高分辨率数字CCD相机记录了包装翘曲信息，并采用三维图像相关方法对该有限元模型进行了验证。利用验证的有限元模型计算了与焊点疲劳寿命相关的FBGA封装的非弹性应变。

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Simulation model development for solder joint reliability for high performance FBGA assemblies

New construction of fine pitch plastic ball grid array (FBGA) has been investigated through experimentation and physics of failure (PoF) analysis based on the reliability point of view. In this study, a three dimensional FEA model was developed to understand the thermomechanical behavior of FBGA under cyclic thermal loading environments. Experimental measurement was also carried out and the package warpage information was recorded by high-resolution digital CCD cameras with a 3-D image correlation method to validate this FEA model. The validated FEA model was used to calculate the inelastic strain of FBGA package that is related to the fatigue life of solder joint.

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Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)

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