热测量的使用一个双极二极管矩阵

B. Geeraerts, W. Van Petegem, W. Sansen
{"title":"热测量的使用一个双极二极管矩阵","authors":"B. Geeraerts, W. Van Petegem, W. Sansen","doi":"10.1109/ICMTS.1993.292923","DOIUrl":null,"url":null,"abstract":"The diode matrix is shown to be an excellent tool for determining thermal constants and temperature distributions on chip. This information can be used to evaluate the electro-thermal simulator and to provide designers with more practical guidelines in designing chips with tight temperature specification. Temperature related problems on chip, such as offset voltage due to temperature gradients and maximum allowable temperature, can now be modeled adequately.<<ETX>>","PeriodicalId":123048,"journal":{"name":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Thermal measurements by use of a SBIMOS diode matrix\",\"authors\":\"B. Geeraerts, W. Van Petegem, W. Sansen\",\"doi\":\"10.1109/ICMTS.1993.292923\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The diode matrix is shown to be an excellent tool for determining thermal constants and temperature distributions on chip. This information can be used to evaluate the electro-thermal simulator and to provide designers with more practical guidelines in designing chips with tight temperature specification. Temperature related problems on chip, such as offset voltage due to temperature gradients and maximum allowable temperature, can now be modeled adequately.<<ETX>>\",\"PeriodicalId\":123048,\"journal\":{\"name\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.1993.292923\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1993.292923","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

二极管矩阵被证明是一个很好的工具,确定热常数和芯片上的温度分布。这些信息可用于评估电热模拟器,并为设计人员在设计严格温度规格的芯片时提供更实用的指导。芯片上的温度相关问题,如由温度梯度和最大允许温度引起的偏置电压,现在可以充分地建模
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal measurements by use of a SBIMOS diode matrix
The diode matrix is shown to be an excellent tool for determining thermal constants and temperature distributions on chip. This information can be used to evaluate the electro-thermal simulator and to provide designers with more practical guidelines in designing chips with tight temperature specification. Temperature related problems on chip, such as offset voltage due to temperature gradients and maximum allowable temperature, can now be modeled adequately.<>
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