{"title":"热测量的使用一个双极二极管矩阵","authors":"B. Geeraerts, W. Van Petegem, W. Sansen","doi":"10.1109/ICMTS.1993.292923","DOIUrl":null,"url":null,"abstract":"The diode matrix is shown to be an excellent tool for determining thermal constants and temperature distributions on chip. This information can be used to evaluate the electro-thermal simulator and to provide designers with more practical guidelines in designing chips with tight temperature specification. Temperature related problems on chip, such as offset voltage due to temperature gradients and maximum allowable temperature, can now be modeled adequately.<<ETX>>","PeriodicalId":123048,"journal":{"name":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Thermal measurements by use of a SBIMOS diode matrix\",\"authors\":\"B. Geeraerts, W. Van Petegem, W. Sansen\",\"doi\":\"10.1109/ICMTS.1993.292923\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The diode matrix is shown to be an excellent tool for determining thermal constants and temperature distributions on chip. This information can be used to evaluate the electro-thermal simulator and to provide designers with more practical guidelines in designing chips with tight temperature specification. Temperature related problems on chip, such as offset voltage due to temperature gradients and maximum allowable temperature, can now be modeled adequately.<<ETX>>\",\"PeriodicalId\":123048,\"journal\":{\"name\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.1993.292923\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1993.292923","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal measurements by use of a SBIMOS diode matrix
The diode matrix is shown to be an excellent tool for determining thermal constants and temperature distributions on chip. This information can be used to evaluate the electro-thermal simulator and to provide designers with more practical guidelines in designing chips with tight temperature specification. Temperature related problems on chip, such as offset voltage due to temperature gradients and maximum allowable temperature, can now be modeled adequately.<>