用太赫兹时域反射法分析LSI互连的失效

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564290

M. Hashimoto, T. Okada, S. Nishina, T. Ataka, M. Shinohara, Yasuhide Maehara, A. Irisawa, M. Imamura

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引用次数: 8

摘要

在先进的集成电路封装技术中，故障定位的识别变得越来越重要。然而，在故障分析过程中，如何精确地确定故障位置是传统的基于电子的时域反射法难以解决的问题。在这项工作中，我们通过将脉冲太赫兹探测信号引入Quad Flat Package，开发了一种时域反射测量技术，其距离到故障的测量误差小于50 μm，其中包括x射线长度测量误差。

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Failure analysis of LSI interconnection by terahertz time-domain reflectometry

It is getting significant to identify the fault location in advanced IC packaging technology. However, challenges have been posed to precisely determine the fault location in the failure analysis process, which is difficult to be handled by the conventional electronic based time domain reflectometry. In this work, we developed a time-domain reflectometry technology with extremely small distance-to-fault measurement error less than 50 μm, which includes X-ray length measuring error, by introducing pulsed terahertz probing signal to Quad Flat Package.

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2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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