J. Burggraf, H. Wiesbauer, Julian Bravin, T. Uhrmann, H. Meynen, Y. Civale, R. John, Sheng Wang, Peng-Fei Fu, C. Yeakle
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引用次数: 1
摘要
这项工作的目的是证明道康宁的临时粘接解决方案与EVG的850XT通用临时粘接和去粘接平台的兼容性。所提出的工艺利用了众所周知的加工步骤和加工模块，如旋转涂层。该工艺包括使用EVG®850TB -300 mm XT框架的释放层(道康宁®WL-3001粘合释放)和粘合层(道康宁®WL-4050或WL-4030粘合粘合剂)。两层材料均采用自旋镀膜的方式涂覆在器件晶圆侧。在本研究的框架中，使用了硅载体。在室温真空条件下进行粘接。使用热板进行粘接后烘烤步骤。在后续的背面处理步骤之后，进行室温脱粘。
An innovative and low cost Bi-layer method for temporary bonding
The purpose of this work was to demonstrate the compatibility of Dow Corning's temporary bonding solution with EVG's 850XT universal temporary bonding and debonding platform. The proposed process made use of well-known processing steps and processing modules like spin coating. The process consisted of a release layer (Dow Corning® WL-3001 Bonding Release) and an adhesive layer (Dow Corning® WL-4050 or WL-4030 Bonding Adhesive) using an EVG® 850TB - 300 mm XT frame. Both layers of material were applied by spin coating on the device wafer side. In the frame of this study, silicon carriers were used. Bonding was performed under vacuum at room temperature. A post bonding bake step was applied using a hotplate. After subsequent backside processing steps, the room temperature debonding was performed.
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