关键的热载流子退化模型校准和验证问题,以实现准确的交流电路级可靠性仿真

Wenjie Jiang, H. Le, S. Dao, S.A. Kim, B. Stine, J. E. Chung, Yu-Jen Wu, P. Bendix, S. Prasad, A. Kapoor, T. Kopley, T. Dungan, I. Manna, P. Marcoux, Lifeng Wu, A. Chen, Zhihong Liu
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引用次数: 16

摘要

本研究提供了必要的退化模型校准和评估指南,以实现更一致和有效地使用热载体可靠性仿真工具。基准测试结果有力地证明,如果校准得当,交流退化模型通常是准确的;然而,SPICE建模误差、二次物理机制和统计参数变化对模拟结果的影响与电路设计本身的差异一样大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Key hot-carrier degradation model calibration and verification issues for accurate AC circuit-level reliability simulation
This study provides necessary degradation model calibration and evaluation guidelines required to enable more consistent and effective use of hot-carrier reliability simulation tools. Benchmark results provide strong verification that the AC degradation models are generally accurate if properly calibrated; however, SPICE modeling errors, secondary physical mechanisms and statistical parameter variation are found to impact the simulated results as much as differences in the circuit design itself.
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