Wenjie Jiang, H. Le, S. Dao, S.A. Kim, B. Stine, J. E. Chung, Yu-Jen Wu, P. Bendix, S. Prasad, A. Kapoor, T. Kopley, T. Dungan, I. Manna, P. Marcoux, Lifeng Wu, A. Chen, Zhihong Liu
{"title":"关键的热载流子退化模型校准和验证问题,以实现准确的交流电路级可靠性仿真","authors":"Wenjie Jiang, H. Le, S. Dao, S.A. Kim, B. Stine, J. E. Chung, Yu-Jen Wu, P. Bendix, S. Prasad, A. Kapoor, T. Kopley, T. Dungan, I. Manna, P. Marcoux, Lifeng Wu, A. Chen, Zhihong Liu","doi":"10.1109/RELPHY.1997.584278","DOIUrl":null,"url":null,"abstract":"This study provides necessary degradation model calibration and evaluation guidelines required to enable more consistent and effective use of hot-carrier reliability simulation tools. Benchmark results provide strong verification that the AC degradation models are generally accurate if properly calibrated; however, SPICE modeling errors, secondary physical mechanisms and statistical parameter variation are found to impact the simulated results as much as differences in the circuit design itself.","PeriodicalId":193458,"journal":{"name":"1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual","volume":"170 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Key hot-carrier degradation model calibration and verification issues for accurate AC circuit-level reliability simulation\",\"authors\":\"Wenjie Jiang, H. Le, S. Dao, S.A. Kim, B. Stine, J. E. Chung, Yu-Jen Wu, P. Bendix, S. Prasad, A. Kapoor, T. Kopley, T. Dungan, I. Manna, P. Marcoux, Lifeng Wu, A. Chen, Zhihong Liu\",\"doi\":\"10.1109/RELPHY.1997.584278\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This study provides necessary degradation model calibration and evaluation guidelines required to enable more consistent and effective use of hot-carrier reliability simulation tools. Benchmark results provide strong verification that the AC degradation models are generally accurate if properly calibrated; however, SPICE modeling errors, secondary physical mechanisms and statistical parameter variation are found to impact the simulated results as much as differences in the circuit design itself.\",\"PeriodicalId\":193458,\"journal\":{\"name\":\"1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual\",\"volume\":\"170 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-04-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1997.584278\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1997.584278","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Key hot-carrier degradation model calibration and verification issues for accurate AC circuit-level reliability simulation
This study provides necessary degradation model calibration and evaluation guidelines required to enable more consistent and effective use of hot-carrier reliability simulation tools. Benchmark results provide strong verification that the AC degradation models are generally accurate if properly calibrated; however, SPICE modeling errors, secondary physical mechanisms and statistical parameter variation are found to impact the simulated results as much as differences in the circuit design itself.