超声粘接的高速相机原位观察

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2014-07-15 DOI:10.1109/LTB-3D.2014.6886184

T. Shuto, T. Asano

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引用次数: 0

摘要

在室温空气环境下，利用超声应用锥形金包实现了微连接。利用高速摄像机对超声粘接过程进行了现场观察，研究了粘接过程的动力学特性。观察到超声作用下凸起的“软化”现象。结果表明，在100ms内键合基本完成。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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In-situ observation of ultrasonic bonding using high speed camera

Room-temperature microjoining in the air ambient has been achieved by using cone-shaped Au bump with ultrasonic application. In-situ observation of the ultrasonic bonding is performed using a high speed camera for the purpose of investigating dynamics of the bonding process. “Softening” of the bump under the application of ultrasonic is observed. It is suggested that bonding is almost completed within 100 ms.

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2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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