高速电子制造中ESD缺陷分析案例研究

2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) Pub Date : 2018-09-01 DOI:10.23919/EOS/ESD.2018.8509738

C. Almeras

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引用次数: 1

摘要

一个高产量、高速度的制造商每30个电路板中就有1个元件缺陷。失败特征与cdm相似。进行根本原因评估，找出罪魁祸首并实施纠正措施。本文详细讨论了问题、调查和纠正措施。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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An ESD Case Study of Defect Analysis in High Speed Electronics Manufacturing

A high volume, high speed manufacturer experienced component defects at a rate of 1 in every 30 boards. Failure signature was CDM–like. Root cause evaluation was undertaken to find the culprit/s and implement corrective actions. Details of the problem, investigation and corrective action are discussed in this paper.

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来源期刊

2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)

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