{"title":"应变速率对微型无铅合金拉伸性能的影响","authors":"Y. Toyama, I. Shohji","doi":"10.1109/IEMT.2012.6521839","DOIUrl":null,"url":null,"abstract":"Tensile properties of several lead-free solder were investigated at a strain rate ranging from 2 × 10-3 s-1 to 2 × 102 s-1 at room temperature using micro-size specimens. Five kinds of lead-free solder which are Sn-3mass%Ag-0.5mass%Cu, Sn-0.7mass%Cu, Sn-5mass%Sb, Sn-8.5mass%Sb and Sn-13mass%Sb were prepared. Sn-37mass%Pb solder was also prepared as a comparison. Tensile strength increases with increasing the strain rate and is proportional to the logarithm of the strain rate. In Sn-3Ag-0.5Cu and Sn-37Pb solder, specimens were necked uniformly and dimple fracture mainly occurred. Tensile strength became relatively high in those solder. In Sn-0.7Cu, Sn-5Sb and Sn-8.5Sb solder, specimens were not necked uniformly and chisel point fracture was observed. Tensile strength of such solder became relatively low compared with those of Sn-3Ag-0.5Cu and Sn-37Pb solder. In Sn-13Sb solder, brittle fracture occurred and elongation decreased compared with other solder. For elongation, Sn-5Sb and Sn-8.5Sb solder showed an excellent value of approximately 90% at the maximum strain rate investigated.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Effect of strain rate on tensile properties of miniature size lead-free alloys\",\"authors\":\"Y. Toyama, I. Shohji\",\"doi\":\"10.1109/IEMT.2012.6521839\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Tensile properties of several lead-free solder were investigated at a strain rate ranging from 2 × 10-3 s-1 to 2 × 102 s-1 at room temperature using micro-size specimens. Five kinds of lead-free solder which are Sn-3mass%Ag-0.5mass%Cu, Sn-0.7mass%Cu, Sn-5mass%Sb, Sn-8.5mass%Sb and Sn-13mass%Sb were prepared. Sn-37mass%Pb solder was also prepared as a comparison. Tensile strength increases with increasing the strain rate and is proportional to the logarithm of the strain rate. In Sn-3Ag-0.5Cu and Sn-37Pb solder, specimens were necked uniformly and dimple fracture mainly occurred. Tensile strength became relatively high in those solder. In Sn-0.7Cu, Sn-5Sb and Sn-8.5Sb solder, specimens were not necked uniformly and chisel point fracture was observed. Tensile strength of such solder became relatively low compared with those of Sn-3Ag-0.5Cu and Sn-37Pb solder. In Sn-13Sb solder, brittle fracture occurred and elongation decreased compared with other solder. For elongation, Sn-5Sb and Sn-8.5Sb solder showed an excellent value of approximately 90% at the maximum strain rate investigated.\",\"PeriodicalId\":315408,\"journal\":{\"name\":\"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.2012.6521839\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2012.6521839","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of strain rate on tensile properties of miniature size lead-free alloys
Tensile properties of several lead-free solder were investigated at a strain rate ranging from 2 × 10-3 s-1 to 2 × 102 s-1 at room temperature using micro-size specimens. Five kinds of lead-free solder which are Sn-3mass%Ag-0.5mass%Cu, Sn-0.7mass%Cu, Sn-5mass%Sb, Sn-8.5mass%Sb and Sn-13mass%Sb were prepared. Sn-37mass%Pb solder was also prepared as a comparison. Tensile strength increases with increasing the strain rate and is proportional to the logarithm of the strain rate. In Sn-3Ag-0.5Cu and Sn-37Pb solder, specimens were necked uniformly and dimple fracture mainly occurred. Tensile strength became relatively high in those solder. In Sn-0.7Cu, Sn-5Sb and Sn-8.5Sb solder, specimens were not necked uniformly and chisel point fracture was observed. Tensile strength of such solder became relatively low compared with those of Sn-3Ag-0.5Cu and Sn-37Pb solder. In Sn-13Sb solder, brittle fracture occurred and elongation decreased compared with other solder. For elongation, Sn-5Sb and Sn-8.5Sb solder showed an excellent value of approximately 90% at the maximum strain rate investigated.
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