利用综合建模方法预测系统级ESD稳健性

2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) Pub Date : 2018-09-01 DOI:10.23919/EOS/ESD.2018.8509746

C. Russ, Michael Ammer, K. Esmark

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引用次数: 5

摘要

对集成电路的系统级ESD鲁棒性进行了仿真，包括所有外部元件。电热模型被校准为集成电路故障的功率分布。结果为预测板级或芯片级保护的联合有效性提供了很大的信心，以应对不断变化的系统要求或不同的ESD枪。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Predicting System Level ESD Robustness Using a Comprehensive Modelling Approach

The system level ESD robustness of ICs is simulated including all external components. An electro-thermal model is calibrated to power profiles of IC failures. Results provide great confidence for prediction of the joint effectiveness of board- or chip-level protection in reaction to changing system requirements or to different ESD guns.

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2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)

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