填充物含量对倒装片粘结底填料拉伸性能的影响

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2012-11-01 DOI:10.1109/IEMT.2012.6521838

S. Kitagoh, H. Mitsugi, S. Koyama, I. Shohji

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引用次数: 2

摘要

采用双酚f型环氧树脂和球状SiO2填料组成的底填料，研究了填料含量和温度对底填料拉伸性能的影响。随着SiO2填料含量的增加，下填料的杨氏模量增大，断裂应变减小。SiO2填料含量对杨氏模量和断裂应变的影响较大。然而，对抗拉强度的影响可以忽略不计。抗拉强度受基体树脂本身强度的影响较大。当温度高于Tg时，杨氏模量减小，断裂应变显著增大。断裂主要发生在Tg以下的基体树脂和Tg以上的基体树脂与填料之间的界面。

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Effect of filler content on tensile properties of underfill material for flip chip bonding

The effects of the filler content and temperature on tensile properties of underfill were investigated using underfill materials which are composed of bisphenol F-type epoxy resin and spheroidal SiO2 filler. Young's modulus of underfill increased and fracture strain decreased with increasing the SiO2 filler content. The effects of the SiO2 filler content on Young's modulus and fracture strain were relatively large. However, the effect on tensile strength was negligible. Tensile strength was strongly affected by the strength of matrix resin itself. When the temperature was above Tg, Young's modulus decreased and fracture strain increased remarkably. Fracture mainly occurred in matrix resin below Tg and in the interface between matrix resin and filler above Tg.

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来源期刊

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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