Masaharu Furuyama, Hideaki Nagaoka, T. Akahoshi, D. Mizutani, S. Sakuyama, M. Nagatake, Nobutaka Itoh
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Simulation Approach to Predict Warpage based on Resin Curing Behavior during Substrate Manufacturing Process
Progress in the high-density mounting of electronic equipment warrants a manufacturing technique for suppressing the warpage of the circuit board and an analysis technique for predicting warpage. In this study, we developed a technique to accurately predict the difference in circuit board warpage caused by variations in manufacturing process by simulating resin curing behavior. As a result, the manufacturing process was optimized to reduce mounting failure caused by substrate warpage.
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