用于异质集成的微转移印花

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2019-05-21 DOI:10.23919/LTB-3D.2019.8735381

B. Corbett, Z. Li, K. Buehler, F. Naumann, U. Krieger, S. Wicht, C. Bower

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引用次数: 0

摘要

微转移印刷是实现不同材料和器件异质集成的关键技术。该技术特别适用于光子学，因为一个典型的系统需要不同的组件阵列。

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Micro-transfer-printing for heterogeneous integration

Micro-transfer-printing is a key enabling technology for the heterogeneous integration of different materials and devices. The technique is particularly applicable to photonics where a typical system requires diverse arrays of components.

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来源期刊

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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