{"title":"非共线PNPN结构的锁存模型","authors":"Collin Reiman, N. Jack, E. Rosenbaum","doi":"10.23919/EOS/ESD.2018.8509739","DOIUrl":null,"url":null,"abstract":"A scalable I-V model for latch-up in non-collinear PNPN devices is adapted from a previous model for collinear SCR devices. The model is applied to 14-nm FinFET test structures. Layout scaling trends for key latch-up metrics, such as holding and trigger voltage, are captured by the model in circuit simulation. TCAD simulation is used to gain physical insight into the behavior of non-collinear PNPN devices.","PeriodicalId":328499,"journal":{"name":"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Latch-up Model of Non-collinear PNPN Structures\",\"authors\":\"Collin Reiman, N. Jack, E. Rosenbaum\",\"doi\":\"10.23919/EOS/ESD.2018.8509739\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A scalable I-V model for latch-up in non-collinear PNPN devices is adapted from a previous model for collinear SCR devices. The model is applied to 14-nm FinFET test structures. Layout scaling trends for key latch-up metrics, such as holding and trigger voltage, are captured by the model in circuit simulation. TCAD simulation is used to gain physical insight into the behavior of non-collinear PNPN devices.\",\"PeriodicalId\":328499,\"journal\":{\"name\":\"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)\",\"volume\":\"61 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/EOS/ESD.2018.8509739\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/EOS/ESD.2018.8509739","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A scalable I-V model for latch-up in non-collinear PNPN devices is adapted from a previous model for collinear SCR devices. The model is applied to 14-nm FinFET test structures. Layout scaling trends for key latch-up metrics, such as holding and trigger voltage, are captured by the model in circuit simulation. TCAD simulation is used to gain physical insight into the behavior of non-collinear PNPN devices.