三维TSV SiP的高性能全局电磁噪声抑制方法

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI:10.1109/EPEPS.2016.7835423

Yong-Wei Chen, Mu-Shui Zhang, Y. Li

{"title":"三维TSV SiP的高性能全局电磁噪声抑制方法","authors":"Yong-Wei Chen, Mu-Shui Zhang, Y. Li","doi":"10.1109/EPEPS.2016.7835423","DOIUrl":null,"url":null,"abstract":"In this paper, we propose a high-performance method to suppress global electromagnetic noise coupling in 3D through silicon via (TSV) system in package (SiP). This technique needs to form a periodic shielding structure in 3D SiP, which consists of contact arrays, grid ground planes and ground TSV array. Contact arrays and grid ground planes can suppress noise coupling in the shallow substrate and ground TSV array suppresses noise coupling in the deep substrate. This method is practical for noise suppression in 3D SiP with heterogeneous integration. Results show that it has a better performance when it is compared to the guard ring method even the working frequency reaches 50 GHz.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":"177 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A high-performance global eletromagnetic noise suppression method for 3D TSV SiP\",\"authors\":\"Yong-Wei Chen, Mu-Shui Zhang, Y. Li\",\"doi\":\"10.1109/EPEPS.2016.7835423\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we propose a high-performance method to suppress global electromagnetic noise coupling in 3D through silicon via (TSV) system in package (SiP). This technique needs to form a periodic shielding structure in 3D SiP, which consists of contact arrays, grid ground planes and ground TSV array. Contact arrays and grid ground planes can suppress noise coupling in the shallow substrate and ground TSV array suppresses noise coupling in the deep substrate. This method is practical for noise suppression in 3D SiP with heterogeneous integration. Results show that it has a better performance when it is compared to the guard ring method even the working frequency reaches 50 GHz.\",\"PeriodicalId\":241629,\"journal\":{\"name\":\"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)\",\"volume\":\"177 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2016.7835423\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2016.7835423","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

在本文中，我们提出了一种高性能的方法来抑制全局电磁噪声耦合在三维通过硅孔封装系统(SiP)。该技术需要在三维SiP中形成周期屏蔽结构，该结构由接触阵列、网格接平面和接地TSV阵列组成。接触阵列和栅格接地面可以抑制浅层衬底中的噪声耦合，接地TSV阵列可以抑制深层衬底中的噪声耦合。该方法适用于异构集成的三维SiP噪声抑制。结果表明，当工作频率达到50 GHz时，与保护环法相比，该方法具有更好的性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A high-performance global eletromagnetic noise suppression method for 3D TSV SiP

In this paper, we propose a high-performance method to suppress global electromagnetic noise coupling in 3D through silicon via (TSV) system in package (SiP). This technique needs to form a periodic shielding structure in 3D SiP, which consists of contact arrays, grid ground planes and ground TSV array. Contact arrays and grid ground planes can suppress noise coupling in the shallow substrate and ground TSV array suppresses noise coupling in the deep substrate. This method is practical for noise suppression in 3D SiP with heterogeneous integration. Results show that it has a better performance when it is compared to the guard ring method even the working frequency reaches 50 GHz.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)

自引率

0.00%

发文量