与低钾电介质和铜兼容的清洗工艺策略:现状、演变和观点

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) Pub Date : 2000-06-05 DOI:10.1109/IITC.2000.854339

D. Louis, A. Beverina, C. Arvet, E. Lajoinie, C. Peyne, D. Holmes, D. Maloney, S. Lee, W.M. Lee

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引用次数: 2

摘要

这项工作提出了低k/铜集成互连清洗的分析。分析和电气数据相结合，以了解在铜和有机，硅基和混合电介质存在下各种可用的清洁化学物质的机制和功效。

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Cleaning process strategies compatible with low-k dielectric and copper: state of the art, evolution and perspectives

This work presents an analysis of interconnect cleaning for low-k/copper integration. Analytical and electrical data are combined to understand the mechanisms and efficacy of various available cleaning chemistries in the presence of Cu and organic, Si-based, and hybrid dielectrics.

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Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)

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