{"title":"阻尼和谐振在薄膜集成去耦电容器设计中的重要性","authors":"J. Bandyopadhyay, P. Chahal, M. Swaminathan","doi":"10.1109/EPEP.1997.634031","DOIUrl":null,"url":null,"abstract":"This paper discusses the design of integrated decoupling capacitors required to suppress delta-I noise in high performance digital packages. The use of damping to reduce the effect of resonance in capacitors is discussed using lossy, gridded structures.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Importance of damping and resonance in thin-film integrated decoupling capacitor design\",\"authors\":\"J. Bandyopadhyay, P. Chahal, M. Swaminathan\",\"doi\":\"10.1109/EPEP.1997.634031\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses the design of integrated decoupling capacitors required to suppress delta-I noise in high performance digital packages. The use of damping to reduce the effect of resonance in capacitors is discussed using lossy, gridded structures.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1997.634031\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634031","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Importance of damping and resonance in thin-film integrated decoupling capacitor design
This paper discusses the design of integrated decoupling capacitors required to suppress delta-I noise in high performance digital packages. The use of damping to reduce the effect of resonance in capacitors is discussed using lossy, gridded structures.