R. White, Andrew Dinsdale, Tod E. Robinson, D. Brinkley, Jeffrey E. Csuy, David W. Lee
{"title":"利用纳米加工修复45纳米节点缺陷","authors":"R. White, Andrew Dinsdale, Tod E. Robinson, D. Brinkley, Jeffrey E. Csuy, David W. Lee","doi":"10.1117/12.748668","DOIUrl":null,"url":null,"abstract":"Recently questions have been raised about whether high aspect ratio (HAR) NanoBitsTM can be effectively utilized to repair extension defects in 45 nm node and beyond. The primary concern has been how the effect of NanoBitTM deflection impacts edge placement, sidewall angle and z-depth control repeatability. Higher aspect ratio bits are required for defects that arise as mask feature sizes become smaller. As the aspect ratio of the NanoBitTM continues to increase to meet these demands, the cross sectional area of the bit used for nanomachining becomes thinner and more susceptible to bending under the forces applied during the nanomachining process. This is especially true when deeper features that require HAR NanoBitsTM are being repaired. To overcome this trend RAVE LLC has developed a new repair process that utilizes the strength of the bit shape. Repair of 45 nm node defects that require HAR NanoBitsTM will be demonstrated using a new repair process and cantilever design.","PeriodicalId":308777,"journal":{"name":"SPIE Photomask Technology","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Repairing 45 nm node defects through nano-machining\",\"authors\":\"R. White, Andrew Dinsdale, Tod E. Robinson, D. Brinkley, Jeffrey E. Csuy, David W. Lee\",\"doi\":\"10.1117/12.748668\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Recently questions have been raised about whether high aspect ratio (HAR) NanoBitsTM can be effectively utilized to repair extension defects in 45 nm node and beyond. The primary concern has been how the effect of NanoBitTM deflection impacts edge placement, sidewall angle and z-depth control repeatability. Higher aspect ratio bits are required for defects that arise as mask feature sizes become smaller. As the aspect ratio of the NanoBitTM continues to increase to meet these demands, the cross sectional area of the bit used for nanomachining becomes thinner and more susceptible to bending under the forces applied during the nanomachining process. This is especially true when deeper features that require HAR NanoBitsTM are being repaired. To overcome this trend RAVE LLC has developed a new repair process that utilizes the strength of the bit shape. Repair of 45 nm node defects that require HAR NanoBitsTM will be demonstrated using a new repair process and cantilever design.\",\"PeriodicalId\":308777,\"journal\":{\"name\":\"SPIE Photomask Technology\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-10-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"SPIE Photomask Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.748668\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"SPIE Photomask Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.748668","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Repairing 45 nm node defects through nano-machining
Recently questions have been raised about whether high aspect ratio (HAR) NanoBitsTM can be effectively utilized to repair extension defects in 45 nm node and beyond. The primary concern has been how the effect of NanoBitTM deflection impacts edge placement, sidewall angle and z-depth control repeatability. Higher aspect ratio bits are required for defects that arise as mask feature sizes become smaller. As the aspect ratio of the NanoBitTM continues to increase to meet these demands, the cross sectional area of the bit used for nanomachining becomes thinner and more susceptible to bending under the forces applied during the nanomachining process. This is especially true when deeper features that require HAR NanoBitsTM are being repaired. To overcome this trend RAVE LLC has developed a new repair process that utilizes the strength of the bit shape. Repair of 45 nm node defects that require HAR NanoBitsTM will be demonstrated using a new repair process and cantilever design.