矩形多晶硅膜片:制造和表征

Proceedings of the 15th Biennial University/Government/ Industry Microelectronics Symposium (Cat. No.03CH37488) Pub Date : 2003-09-04 DOI:10.1109/UGIM.2003.1225769

E. Woods, Zhiping Zhou

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引用次数: 0

摘要

矩形气隙隔膜很难进行机械表征。一种标准的制造工艺开发利用相对于膜片尺寸最小的有效蚀刻访问端口，其范围从1406 /spl mu/m/sup 2/到36864 /spl mu/m/sup 2/。在硅衬底上制造厚度为1 /spl mu/m的多晶硅膜片，在1 /spl mu/m气隙之上，并对其进行机械测试，以确定使用标准Berkovich尖端实现最大挠度和初始膜垂所需的相对几何形状和尺寸的力。结果表明:受力曲线、最大位移曲线和卸载力曲线均符合幂律分布;

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Rectangular polysilicon diaphragms: fabrication and characterization

Rectangular air-gap diaphragms are difficult to mechanically characterize. A standard fabrication process developed utilizing the smallest efficient etching access ports relative the diaphragm sizes, which ranged from 1406 /spl mu/m/sup 2/ to 36864 /spl mu/m/sup 2/. Polysilicon diaphragms having a thickness of 1 /spl mu/m above a 1 /spl mu/m air gap were fabricated on a silicon substrate and mechanically tested to determine the amount of force relative to geometry and size required to achieve maximum deflection and initial membrane sag using a standard Berkovich tip. The results showed that the force, maximum displacement, and unloading force curve fits followed power law distributions.

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Proceedings of the 15th Biennial University/Government/ Industry Microelectronics Symposium (Cat. No.03CH37488)

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