{"title":"TherMos3:用于智能电源设备的3D电热模拟器","authors":"A. Irace, G. Breglio, P. Spirito","doi":"10.1109/ISPSD.2006.1666109","DOIUrl":null,"url":null,"abstract":"In this paper, we report on a novel simulation tool designed for the 3D coupled electro-thermal simulation of smart power devices, that is a tool capable of taking into account not only the electrical (and thermal) behaviour of the power device but also the different driving strategies as they are imposed by a control logic circuit which usually resides on the same chip. To validate the proposed approach, simulator results are compared to experimental data obtained on a commercial smart power device used in automotive applications","PeriodicalId":198443,"journal":{"name":"2006 IEEE International Symposium on Power Semiconductor Devices and IC's","volume":"309 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-06-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"TherMos3: a 3D electrothermal simulator for Smart Power Devices\",\"authors\":\"A. Irace, G. Breglio, P. Spirito\",\"doi\":\"10.1109/ISPSD.2006.1666109\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we report on a novel simulation tool designed for the 3D coupled electro-thermal simulation of smart power devices, that is a tool capable of taking into account not only the electrical (and thermal) behaviour of the power device but also the different driving strategies as they are imposed by a control logic circuit which usually resides on the same chip. To validate the proposed approach, simulator results are compared to experimental data obtained on a commercial smart power device used in automotive applications\",\"PeriodicalId\":198443,\"journal\":{\"name\":\"2006 IEEE International Symposium on Power Semiconductor Devices and IC's\",\"volume\":\"309 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-06-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 IEEE International Symposium on Power Semiconductor Devices and IC's\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.2006.1666109\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE International Symposium on Power Semiconductor Devices and IC's","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2006.1666109","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
TherMos3: a 3D electrothermal simulator for Smart Power Devices
In this paper, we report on a novel simulation tool designed for the 3D coupled electro-thermal simulation of smart power devices, that is a tool capable of taking into account not only the electrical (and thermal) behaviour of the power device but also the different driving strategies as they are imposed by a control logic circuit which usually resides on the same chip. To validate the proposed approach, simulator results are compared to experimental data obtained on a commercial smart power device used in automotive applications
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
