接近硅极限:先进的NLDMOS 0.13 μm SOI技术,用于高达110V的汽车和工业应用

Hongning Yang, Jiang-Kai Zuo, Zhihong Zhang, W. Min, Xin Lin, Xu Cheng, M. Ger, P. Hui, P. Rodriquez
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引用次数: 17

摘要

我们开发了一种基于SOI智能电源技术的新型NLDMOS,集成到飞思卡尔的0.13μm CMOS平台中。新的NLDMOS不仅可以在低侧和高侧操作中实现高达140V的BVDSS,更重要的是,Rdson*Area能够比当前基准缩小至少35-40%,这是报道的最低BVDSS范围为50V至138V。我们首次展示了接近Si极限的LDMOS器件。该器件在SOA和HCI压力下的可靠性测试以及高温反向偏置(HTRB)压力下也实现了非常有竞争力的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Approach to the silicon limit: Advanced NLDMOS in 0.13 μm SOI technology for automotive and industrial applications up to 110V
We report our development of a novel NLDMOS in SOI based smart power technology, integrated into Freescale's 0.13μm CMOS platform. The new NLDMOS not only achieves BVDSS up to 140V in both low side and high side operations, but more importantly, the Rdson*Area is able to shrink at least 35-40% below the current benchmark, which is the lowest reported for BVDSS ranging from 50V to 138V. For the first time, we demonstrated LDMOS devices which approach the Si limit. The devices also achieve very competitive performance in both SOA and the reliability tests under HCI stress as well as high temperature reverse bias (HTRB) stress.
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