MCM-L as a cost-effective solution for high-speed digital design

Laminated multi-chip-module technology (MCM-L) is well known for its cost effectiveness in large-volume applications. However, the implementation of advanced designs such as RF-analog or high-speed digital circuits suffers mainly from the large dielectric losses of the organic dielectric layers, conductor losses, and the manufacturing tolerances of state-of-the-art MCM-L technologies. However, if MCM-L substrate behaviour could be modelled and simulated more accurately, these drawbacks could be overcome. Indeed, the basis of accurate simulation results are precise electrical models of the interconnect. In this paper a theoretical analysis of typical MCM-L interconnects and measurements on MCM-L buildups are presented. Based on the measurement results, obtained mainly by TDR/TDT setups, it is demonstrated how MCM-L substrates can be a cost-effective solution for high-speed designs.