{"title":"高密度零插入力微同轴电缆互连技术","authors":"R. Rothenberger, R. Mroczkowski","doi":"10.1109/ECTC.1992.204218","DOIUrl":null,"url":null,"abstract":"A novel high-density zero-insertion-force microcoaxial cable interconnection method has been developed. The system consists of a microferrule to connect to the served shield wires of each coaxial cable, a modular microstrip style coaxial cable to PWB (printed wiring board) connector with compliant pin technology, a variable geometry PWB separable interface contact distribution, and a fine-pitch interposer contact array to serve as the separable interface. This system has been designed with manufacturing as a key design objective and can be semiautomated with careful attention to detail. Contact density is currently 91 contacts per square inch, including provisions for mounting hardware and support structures. A major advantage of this interconnection approach is that it provides a versatile format for custom cable interconnection platforms to meet individual customer requirements for pin counts and signal/ground ratios.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"232 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High-density zero insertion force microcoaxial cable interconnection technology\",\"authors\":\"R. Rothenberger, R. Mroczkowski\",\"doi\":\"10.1109/ECTC.1992.204218\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel high-density zero-insertion-force microcoaxial cable interconnection method has been developed. The system consists of a microferrule to connect to the served shield wires of each coaxial cable, a modular microstrip style coaxial cable to PWB (printed wiring board) connector with compliant pin technology, a variable geometry PWB separable interface contact distribution, and a fine-pitch interposer contact array to serve as the separable interface. This system has been designed with manufacturing as a key design objective and can be semiautomated with careful attention to detail. Contact density is currently 91 contacts per square inch, including provisions for mounting hardware and support structures. A major advantage of this interconnection approach is that it provides a versatile format for custom cable interconnection platforms to meet individual customer requirements for pin counts and signal/ground ratios.<<ETX>>\",\"PeriodicalId\":125270,\"journal\":{\"name\":\"1992 Proceedings 42nd Electronic Components & Technology Conference\",\"volume\":\"232 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-05-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1992 Proceedings 42nd Electronic Components & Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1992.204218\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1992 Proceedings 42nd Electronic Components & Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1992.204218","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High-density zero insertion force microcoaxial cable interconnection technology
A novel high-density zero-insertion-force microcoaxial cable interconnection method has been developed. The system consists of a microferrule to connect to the served shield wires of each coaxial cable, a modular microstrip style coaxial cable to PWB (printed wiring board) connector with compliant pin technology, a variable geometry PWB separable interface contact distribution, and a fine-pitch interposer contact array to serve as the separable interface. This system has been designed with manufacturing as a key design objective and can be semiautomated with careful attention to detail. Contact density is currently 91 contacts per square inch, including provisions for mounting hardware and support structures. A major advantage of this interconnection approach is that it provides a versatile format for custom cable interconnection platforms to meet individual customer requirements for pin counts and signal/ground ratios.<>