使用Au薄膜的室温键合蓝宝石和金属衬底的剪切强度

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947444

H. Kon, M. Uomoto, N. Nakajima, T. Nakaya, T. Shimatsu

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引用次数: 0

摘要

对于蓝宝石和各种金属(铝合金、Cu合金和不锈钢)，在室温下使用Au薄膜粘合，本研究评估了剪切强度。结果表明，所有试样的抗剪强度均大于10 kN (50 MPa)。

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Shear strength of room-temperature-bonded sapphire and metal substrates using Au films

For sapphire and various metals (Al alloys, Cu alloys, and stainless steel) bonded at room temperature using Au films, shear strength was assessed in this study. Results show extremely high shear strength of all samples: greater than 10 kN (50 MPa).

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来源期刊

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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