模块化微系统的设计和生产框架

V. Grosser, M. Schuenemann, B. Michel, H. Reichl
{"title":"模块化微系统的设计和生产框架","authors":"V. Grosser, M. Schuenemann, B. Michel, H. Reichl","doi":"10.1109/MHS.1999.820005","DOIUrl":null,"url":null,"abstract":"The trend to higher integration in microelectronics and the integration of micromechanical, microfluidic and microoptical components require new packaging solutions. A highly flexible design and production framework for microsystems, suitable for mid-scale production at reasonable costs, was developed.","PeriodicalId":423453,"journal":{"name":"MHS'99. Proceedings of 1999 International Symposium on Micromechatronics and Human Science (Cat. No.99TH8478)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A design and production framework for modular microsystems\",\"authors\":\"V. Grosser, M. Schuenemann, B. Michel, H. Reichl\",\"doi\":\"10.1109/MHS.1999.820005\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The trend to higher integration in microelectronics and the integration of micromechanical, microfluidic and microoptical components require new packaging solutions. A highly flexible design and production framework for microsystems, suitable for mid-scale production at reasonable costs, was developed.\",\"PeriodicalId\":423453,\"journal\":{\"name\":\"MHS'99. Proceedings of 1999 International Symposium on Micromechatronics and Human Science (Cat. No.99TH8478)\",\"volume\":\"94 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-11-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"MHS'99. Proceedings of 1999 International Symposium on Micromechatronics and Human Science (Cat. No.99TH8478)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MHS.1999.820005\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"MHS'99. Proceedings of 1999 International Symposium on Micromechatronics and Human Science (Cat. No.99TH8478)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MHS.1999.820005","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

微电子技术和微机械、微流体和微光学元件集成的趋势要求新的封装解决方案。开发了一种高度灵活的微系统设计和生产框架,适用于中等规模的生产,成本合理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A design and production framework for modular microsystems
The trend to higher integration in microelectronics and the integration of micromechanical, microfluidic and microoptical components require new packaging solutions. A highly flexible design and production framework for microsystems, suitable for mid-scale production at reasonable costs, was developed.
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