Botao Shao, R. Weerasekera, A. T. Woldegiorgis, Li-Rong Zheng, Ran Liu, W. Zapka
{"title":"用于低成本RFID应用的柔性基板上喷墨印刷互连的高频特性和建模","authors":"Botao Shao, R. Weerasekera, A. T. Woldegiorgis, Li-Rong Zheng, Ran Liu, W. Zapka","doi":"10.1109/ESTC.2008.4684435","DOIUrl":null,"url":null,"abstract":"This paper presents the characterization and modeling of inkjet printed interconnects on flexible polyimide substrate using nano-particle silver ink for low-cost RFID applications. Then TDR/TDT and S-parameter measurements are performed at high frequency from 30 kHz to 6 GHz. A lumped equivalent circuit and distributed parameter model of the printed interconnects have been developed for the realization of the full printed RFID tags. Additionally the related electrical properties of the printed interconnects are extracted.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"447 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"High frequency characterization and modelling of inkjet printed interconnects on flexible substrate for low-cost RFID applications\",\"authors\":\"Botao Shao, R. Weerasekera, A. T. Woldegiorgis, Li-Rong Zheng, Ran Liu, W. Zapka\",\"doi\":\"10.1109/ESTC.2008.4684435\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the characterization and modeling of inkjet printed interconnects on flexible polyimide substrate using nano-particle silver ink for low-cost RFID applications. Then TDR/TDT and S-parameter measurements are performed at high frequency from 30 kHz to 6 GHz. A lumped equivalent circuit and distributed parameter model of the printed interconnects have been developed for the realization of the full printed RFID tags. Additionally the related electrical properties of the printed interconnects are extracted.\",\"PeriodicalId\":146584,\"journal\":{\"name\":\"2008 2nd Electronics System-Integration Technology Conference\",\"volume\":\"447 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 2nd Electronics System-Integration Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2008.4684435\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 2nd Electronics System-Integration Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2008.4684435","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High frequency characterization and modelling of inkjet printed interconnects on flexible substrate for low-cost RFID applications
This paper presents the characterization and modeling of inkjet printed interconnects on flexible polyimide substrate using nano-particle silver ink for low-cost RFID applications. Then TDR/TDT and S-parameter measurements are performed at high frequency from 30 kHz to 6 GHz. A lumped equivalent circuit and distributed parameter model of the printed interconnects have been developed for the realization of the full printed RFID tags. Additionally the related electrical properties of the printed interconnects are extracted.
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