片上互连趋势、挑战和解决方案:如何控制RC和可靠性

2016 IEEE Symposium on VLSI Technology Pub Date : 2016-06-14 DOI:10.1109/VLSIT.2016.7573426

Z. Tokei, I. Ciofi, P. Roussel, P. Debacker, P. Raghavan, M. H. van der Veen, N. Jourdan, C. Wilson, V. V. Gonzalez, C. Adelmann, L. Wen, K. Croes, O. V. P. K. Moors, M. Krishtab, S. Armini, J. Bommels

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引用次数: 14

摘要

随着技术规模的扩大，互连带来了越来越多的挑战。为了克服这些挑战，同时优化新的金属化方案，需要新的材料，电路和系统级方法。

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On-chip interconnect trends, challenges and solutions: How to keep RC and reliability under control

Interconnects pose increasing challenges as technology scaling proceeds. In order to overcome these challenges simultaneous optimization of novel metallization schemes, new materials, circuit and system level approaches are required.

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来源期刊

2016 IEEE Symposium on VLSI Technology

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