{"title":"发射端SMA跟踪跃迁的射频建模与优化","authors":"H. Zha, Diqun Lu, Wei Wang, F. Lin","doi":"10.1109/EPTC.2015.7412280","DOIUrl":null,"url":null,"abstract":"In this paper, lumped element model of end-launch Sub-Miniature version A (SMA) to trace transition is presented, based on verified scattering-parameters from EM simulation. SMA is mounted on four-layer PCB and standard FR4 is chosen as its dielectric substrate. Close agreement between EM simulation and proposed model is obtained for S-parameters up to 20GHz. Moreover, based on the equivalent circuit, the optimization of impedance discontinuity of this transition is investigated, both return loss and impedance properties are experimentally validated with the improvement.","PeriodicalId":418705,"journal":{"name":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","volume":"100 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"RF modeling and optimization of end-launch SMA to trace transition\",\"authors\":\"H. Zha, Diqun Lu, Wei Wang, F. Lin\",\"doi\":\"10.1109/EPTC.2015.7412280\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, lumped element model of end-launch Sub-Miniature version A (SMA) to trace transition is presented, based on verified scattering-parameters from EM simulation. SMA is mounted on four-layer PCB and standard FR4 is chosen as its dielectric substrate. Close agreement between EM simulation and proposed model is obtained for S-parameters up to 20GHz. Moreover, based on the equivalent circuit, the optimization of impedance discontinuity of this transition is investigated, both return loss and impedance properties are experimentally validated with the improvement.\",\"PeriodicalId\":418705,\"journal\":{\"name\":\"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)\",\"volume\":\"100 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2015.7412280\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2015.7412280","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
RF modeling and optimization of end-launch SMA to trace transition
In this paper, lumped element model of end-launch Sub-Miniature version A (SMA) to trace transition is presented, based on verified scattering-parameters from EM simulation. SMA is mounted on four-layer PCB and standard FR4 is chosen as its dielectric substrate. Close agreement between EM simulation and proposed model is obtained for S-parameters up to 20GHz. Moreover, based on the equivalent circuit, the optimization of impedance discontinuity of this transition is investigated, both return loss and impedance properties are experimentally validated with the improvement.
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