采用SOI技术的低功耗、高速CMOS器件的设计方法

A. Yoshino, K. Kumagai, S. Kurosawa, H. Itoh, K. Okumura
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引用次数: 6

摘要

我们使用电路模拟器SPICE,在最简单的假设下,比较了大块结构和SOI结构的CMOS栅极性能。主要结果如下:(1)我们已经证明可以使用电路模拟器SPICE来估计CMOS/SOI性能,而不需要任何特定的SOI晶体管物理模型。(2)随着电源电压的降低,CMOS/SOI技术对漏极寄生电容的降低效果更加显著。(3)只要增加CMOS/SOI的通道宽度,保持其功耗与CMOS/BULK相同,就可以显著改善对大负载电容的传播延迟时间依赖,并具有更高的驱动性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design methodology for low power, high-speed CMOS devices utilizing SOI technology
We have compared CMOS gate performances between bulk and SOI structures, using the circuit simulator SPICE with the simplest assumptions. Main results are as follows: (1) We have demonstrated that it is possible to estimate CMOS/SOI performances using the circuit simulator SPICE without any specific physical models for SOI transistors. (2) The reduction effect of the drain parasitic capacitance by the CMOS/SOI technology becomes more remarkable with a decrease in the supply voltage. (3) Just by increasing the channel width of the CMOS/SOI keeping its power consumption equal to that of the CMOS/BULK, the propagation delay time dependence on large load capacitance can be improved dramatically with higher drivability.<>
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