基于测试片重复的低功耗测试解压缩理论分析

Szu-Pang Mu, M. Chao
{"title":"基于测试片重复的低功耗测试解压缩理论分析","authors":"Szu-Pang Mu, M. Chao","doi":"10.1109/VTS.2010.5469591","DOIUrl":null,"url":null,"abstract":"This paper presents a single-test-input test-decompression scheme, named STSD, which utilize the technique of test-slice duplication to reduce the test-data volume as well as the signal transitions along scan paths. The encoding of STSD scheme focuses on maximizing the number of duplications made by a test-slice template. Mathematical models are also developed in this paper to estimate the compression ratio, test-application time, and scan-in transitions caused by STSD scheme, and in turn can further help designers to efficiently identify the best configuration of STSD scheme instead of going through a time-consuming simulation process. The experimental results based on large ISCAS and ITC benchmark circuits demonstrate the accuracy of the proposed mathematical models and the advantages of using STSD scheme.","PeriodicalId":176745,"journal":{"name":"2010 28th VLSI Test Symposium (VTS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Theoretical analysis for low-power test decompression using test-slice duplication\",\"authors\":\"Szu-Pang Mu, M. Chao\",\"doi\":\"10.1109/VTS.2010.5469591\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a single-test-input test-decompression scheme, named STSD, which utilize the technique of test-slice duplication to reduce the test-data volume as well as the signal transitions along scan paths. The encoding of STSD scheme focuses on maximizing the number of duplications made by a test-slice template. Mathematical models are also developed in this paper to estimate the compression ratio, test-application time, and scan-in transitions caused by STSD scheme, and in turn can further help designers to efficiently identify the best configuration of STSD scheme instead of going through a time-consuming simulation process. The experimental results based on large ISCAS and ITC benchmark circuits demonstrate the accuracy of the proposed mathematical models and the advantages of using STSD scheme.\",\"PeriodicalId\":176745,\"journal\":{\"name\":\"2010 28th VLSI Test Symposium (VTS)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 28th VLSI Test Symposium (VTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VTS.2010.5469591\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 28th VLSI Test Symposium (VTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTS.2010.5469591","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

本文提出了一种单测试输入测试解压缩方案,称为STSD,该方案利用测试片重复技术来减少测试数据量和沿扫描路径的信号转换。STSD方案的编码重点是使测试片模板的重复次数最大化。本文还建立了数学模型来估计由STSD方案引起的压缩比、测试应用时间和扫描过渡,从而进一步帮助设计人员有效地确定STSD方案的最佳配置,而不是通过耗时的仿真过程。基于大型ISCAS和ITC基准电路的实验结果证明了所提数学模型的准确性和采用STSD方案的优越性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Theoretical analysis for low-power test decompression using test-slice duplication
This paper presents a single-test-input test-decompression scheme, named STSD, which utilize the technique of test-slice duplication to reduce the test-data volume as well as the signal transitions along scan paths. The encoding of STSD scheme focuses on maximizing the number of duplications made by a test-slice template. Mathematical models are also developed in this paper to estimate the compression ratio, test-application time, and scan-in transitions caused by STSD scheme, and in turn can further help designers to efficiently identify the best configuration of STSD scheme instead of going through a time-consuming simulation process. The experimental results based on large ISCAS and ITC benchmark circuits demonstrate the accuracy of the proposed mathematical models and the advantages of using STSD scheme.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信