多级互连用铜镁合金的集成与可靠性

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) Pub Date : 2000-06-05 DOI:10.1109/IITC.2000.854335

Gregor Braeckelmann, Ramnath Venkatraman, Cristiano Capasso, Matthew Herrick

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引用次数: 8

摘要

本文讨论了铜镁合金在集成电路互连结构中的沉积、集成、性能和可靠性。将详细讨论与过程相关的特征。本文特别强调了铜镁的粘附和扩散性能。此外，还介绍了铜镁合金测试结构的电学性能和电迁移测试结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Integration and reliability of copper magnesium alloys for multilevel interconnects

This paper discusses the deposition, integration, performance, and reliability of copper-magnesium alloys in interconnect structures for state of the art integrated circuits. A detailed discussion of process-related characteristics will be presented. Special emphasis is given here on the adhesion and diffusion properties of copper-magnesium. Furthermore, electrical performance of test structures using copper-magnesium and results from electromigration testing are being presented.

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Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)

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