保持双方共赢:2000年及以后的晶圆制造设备供应商和半导体制造商

Maydan
{"title":"保持双方共赢:2000年及以后的晶圆制造设备供应商和半导体制造商","authors":"Maydan","doi":"10.1109/VLSIT.1997.623668","DOIUrl":null,"url":null,"abstract":"Global demand for semiconductor IC solutions has kept both semiconductor manufacturers and wafer fabrication equipment suppliers in a state of rapid growth since the 1970's. As the next century approaches, new manufacturing challenges arise due to decreasing feature sizes, increasing metal layers, and the transition to 300\" wafer size. Technology and productivity shifts such as these represent tremendous economic risks for both semiconductor manufacturers and equipment suppliers. This paper will briefly discuss historical drivers of growth for both semiconductor manufacturers and equipment suppliers, examine semiconductor manufacturers' priorities for the year 2000 and beyond, discuss equipment trends for the 2lSt century, and highlight winning strategies for the next century for wafer processing.","PeriodicalId":414778,"journal":{"name":"1997 Symposium on VLSI Technology","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Keeping Both Sides Winning: Wafer Fabrication Equipment Suppliers And Semiconductor Manufacturers In The Year 2000 And Beyond\",\"authors\":\"Maydan\",\"doi\":\"10.1109/VLSIT.1997.623668\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Global demand for semiconductor IC solutions has kept both semiconductor manufacturers and wafer fabrication equipment suppliers in a state of rapid growth since the 1970's. As the next century approaches, new manufacturing challenges arise due to decreasing feature sizes, increasing metal layers, and the transition to 300\\\" wafer size. Technology and productivity shifts such as these represent tremendous economic risks for both semiconductor manufacturers and equipment suppliers. This paper will briefly discuss historical drivers of growth for both semiconductor manufacturers and equipment suppliers, examine semiconductor manufacturers' priorities for the year 2000 and beyond, discuss equipment trends for the 2lSt century, and highlight winning strategies for the next century for wafer processing.\",\"PeriodicalId\":414778,\"journal\":{\"name\":\"1997 Symposium on VLSI Technology\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-06-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 Symposium on VLSI Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSIT.1997.623668\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.1997.623668","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

自20世纪70年代以来,全球对半导体集成电路解决方案的需求使半导体制造商和晶圆制造设备供应商处于快速增长的状态。随着下个世纪的临近,由于特征尺寸的减小、金属层的增加以及向300英寸晶圆尺寸的过渡,新的制造挑战出现了。诸如此类的技术和生产力转变对半导体制造商和设备供应商来说都是巨大的经济风险。本文将简要讨论半导体制造商和设备供应商增长的历史驱动因素,研究半导体制造商在2000年及以后的优先事项,讨论21世纪的设备趋势,并强调下个世纪的晶圆加工制胜战略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Keeping Both Sides Winning: Wafer Fabrication Equipment Suppliers And Semiconductor Manufacturers In The Year 2000 And Beyond
Global demand for semiconductor IC solutions has kept both semiconductor manufacturers and wafer fabrication equipment suppliers in a state of rapid growth since the 1970's. As the next century approaches, new manufacturing challenges arise due to decreasing feature sizes, increasing metal layers, and the transition to 300" wafer size. Technology and productivity shifts such as these represent tremendous economic risks for both semiconductor manufacturers and equipment suppliers. This paper will briefly discuss historical drivers of growth for both semiconductor manufacturers and equipment suppliers, examine semiconductor manufacturers' priorities for the year 2000 and beyond, discuss equipment trends for the 2lSt century, and highlight winning strategies for the next century for wafer processing.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信