在Ge(100)上具有UHV-Ga2O3(Gd2O3)的金属氧化物半导体器件

L. Chu, T. Lin, C. H. Lee, L. T. Tung, W. Lee, R. Chu, C. C. Chang, M. Hong, J. Kwo
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引用次数: 0

摘要

超高真空(UHV)沉积的高Ga2O3(Gd2O3)被证明可以有效地钝化锗,这一点得到了包括结构、化学和电分析在内的综合研究的证明。结果表明,在500℃退火条件下,Ga2O3(Gd2O3)/Ge界面呈现突变态,其κ值高达14.5,漏电流密度低至~ 10−9A/cm2,具有Fowler-Nordheim隧穿行为,且具有良好的C- v特性。此外,以Al2O3/ Ga2O3(Gd2O3)作为栅极介质的Ge自定向pmosfet显示出高漏极电流和峰值跨导分别高达252mA/mm和143mS/mm,栅极长度为1 μ m。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Metal-oxide-semiconductor devices with UHV-Ga2O3(Gd2O3) on Ge(100)
Ultra-high vacuum (UHV)-deposited high Ga2O3(Gd2O3) was proved to passivate Ge effectively, as evidenced by comprehensive investigations including structural, chemical, and electrical analyses. The Ga2O3(Gd2O3)/Ge interface is revealed to be abrupt even being subjected to a 500°C anneal, a high κ value of 14.5, a low leakage current density of ∼10−9A/cm2 with a Fowler-Nordheim tunneling behavior, and well-behaved C-V characteristics are achieved. Furthermore, Ge self-aligned pMOSFETs with Al2O3/ Ga2O3(Gd2O3) as the gate dielectrics have demonstrated a high drain current and a peak transconductance up to 252mA/mm and 143mS/mm, respectively, of 1µm-gate length.
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