用于精确测量DMOS功率晶体管温度的小型嵌入式传感器

M. Pfost, D. Costachescu, A. Podgaynaya, M. Stecher, S. Bychikhin, D. Pogany, E. Gornik
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引用次数: 23

摘要

器件温度是影响功率DMOS晶体管安全工作区域和可靠性的重要因素之一。因此,需要对其固有器件温度进行精确测量。然而,红外热成像等标准方法通常不能应用于先进的智能电源技术,因为厚的电源金属层掩盖了通常明显更热的有源器件区域。因此,我们建议在有源DMOS单元阵列中嵌入非常小的温度传感器。这些传感器允许器件固有温度的准确读数,而不影响DMOS的行为明显。这些传感器的校准温度可达600°C,与TIM测量温度可达400°C进行比较验证,并用于研究热失控。在一个大功率DMOS中嵌入60个传感器,采用片上模拟多路复用技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Small embedded sensors for accurate temperature measurements in DMOS power transistors
Device temperature is one of the most important limits for the safe operating area and the reliability of power DMOS transistors. Therefore, accurate measurements of their intrinsic device temperature are required. However, standard methods such as IR thermography usually cannot be applied to advanced smart power technologies where a thick power metal layer obscures the - often significantly hotter - active device area. Thus, we propose to embed very small temperature sensors in the active DMOS cell array. These sensors allow for an accurate reading of the intrinsic device temperature while not influencing the DMOS behavior noticeably. The sensors are calibrated up to 600°C, validated by comparison to TIM measurements up to 400°C, and used to investigate thermal runaway. Results from 60 sensors embedded in one large power DMOS with on-chip analog multiplexing are also presented.
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