低功耗表面微加工多晶硅热板的热模拟

1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351) Pub Date : 1998-10-06 DOI:10.1109/SMICND.1998.732287

M. Dumitrescu, C. Cobianu, D. Lungu, D. Dascalu, A. Pascu, S. Kolev, A. van den Berg

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引用次数: 26

摘要

设计了一种简单的、集成电路兼容的表面微加工多晶硅膜，并通过3D有限元“COSMOS”程序进行了热模拟，以研究其作为微热板用于低功耗气敏测试结构的能力。对于一个优化的布局，基于四个“聚”悬索桥和一个中央“聚”柱支撑110/spl倍/110 /spl亩/米的“聚”膜，通过1 /spl亩/米的气间隙与硅衬底分离，在输入功率为100兆瓦的情况下，温度高达673 K。

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Thermal simulation of surface micromachined polysilicon hot plates of low power consumption

A simple, IC compatible, surface micromachined polysilicon membrane was technologically designed and thermally simulated by 3D finite element "COSMOS" program in order to investigate its capability to work as a micro hot plate for a gas sensing test structure of low power consumption. For an optimised lay-out based on four "poly" suspended bridges and a central "poly" pillar supporting the 110/spl times/110 /spl mu/m "poly" membrane separated from the silicon substrate by 1 /spl mu/m of air gap, temperatures as high as 673 K were obtained for an input power of 100 mW.

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1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351)

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