New packaging technology of highly stable “On-Chip” mode quantum dots LED

An highly efficient and stable OC-QLED (“On-Chip” mode quantum dots light-emitting diode, OC-QLED) was obtained by the new LED packaging method with quantum dots encapsulation, Which was well-suitable for the backlight module whose color gamut value > NTSC 103%. Firstly, the results of orthogonal designed experiment showed that the encapsulation method of quantum dots was the most significantly factor on reliability and luminous efficiency of OC-QLED in the 4 factors (quantum dots coating method, encapsulation compound, curing temperature and heating time). Then, the reliability and luminous efficiency of sandwich structure OC-QLED encapsulation (the sandwich structure meant encapsulate compound with clear silicone, red QD and green QD was placed on the blue LED chip layerly) were better than those of other structures. The luminous efficiency of sandwich structure OC-QLED was reported to 81% of that of the LED with YAG: Ce phosphor under the same packaging setting. The OC-QLED brightness slightly decayed 9.5% under 85 °C and 85 % humidity after 500 hour burning test and 5000 mW/cm2 optical power density of the package, respectively.