具有10nm及以上高迁移率SiGe通道的FINFET技术

Dechao Guo, G. Karve, Gen Tsutsui, K. Lim, R. Robison, T. Hook, Reinaldo A. Vega, Derrick Liu, S. Bedell, S. Mochizuki, F. Lie, Kerem Akarvardar, Miaomiao Wang, Ruqiang Bao, Sean D. Burns, Victor Chan, K. Cheng, J. Demarest, Jody A. Fronheiser, Pouya Hashemi, James J. Kelly, Jinghong Li, Nicolas Loubet, P. Montanini, Bhagawan Sahu, M. Sankarapandian, S. Sieg, J. Sporre, J. Strane, R. Southwick, N. Tripathi, R. Venigalla, Junli Wang, Koji Watanabe, C. Yeung, D. Gupta, Bruce B. Doris, Nelson Felix, Ajey Poovannummoottil Jacob, H. Jagannathan, S. Kanakasabapathy, Renee T. Mo, Vijay Narayanan, D. Sadana, P. Oldiges, J. Stathis, T. Yamashita, V. Paruchuri, M. Colburn, Andreas Knorr, R. Divakaruni, H. Bu, M. Khare
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引用次数: 44

摘要

在将FINFET引入CMOS技术后,沟道材料的SiGe被探索为主要的技术元素[1-4]。对长沟道场效应管和离散短沟道场效应管的研究表明,它们在移动性[1-4]和可靠性[2]方面具有优势。考虑到SiGe FIN带来的破坏,与SiGe FIN相关的每个方面都需要仔细研究技术插入。在本文中,我们报告了基于sigg的FINFET CMOS技术的最新发展。具有Si-FIN fet和SiGe-FIN fet的CMOS finfet被证明是一种可行的技术解决方案,适用于10nm节点及以上的服务器和移动应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
FINFET technology featuring high mobility SiGe channel for 10nm and beyond
SiGe for channel material has been explored as a major technology element after the introduction of FINFET into CMOS technology [1-4]. Research on long channel FETs and discrete short channel FETs demonstrated benefits in mobility [1-4] and reliability [2]. Given the disruption that SiGe FIN brings, every aspect associated with SiGe FIN needs to be carefully studied towards technology insertion. In this paper, we report the latest SiGe-based FINFET CMOS technology development. CMOS FINFETs with Si-FIN nFET and SiGe-FIN pFET is demonstrated as a viable technology solution for both server and mobile applications at 10nm node and beyond.
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