基于三维集成的系统集成技术

M. Koyanagi
{"title":"基于三维集成的系统集成技术","authors":"M. Koyanagi","doi":"10.1109/IMFEDK56875.2022.9975417","DOIUrl":null,"url":null,"abstract":"A heterogeneous 3D system integration technology is the key technology to achieve future high-performance and energy efficient systems such as high-performance computer system, AI system, post 5G/6G system and quantum computing system. Current status and future prospect of heterogeneous 3D system integration technology are discussed.","PeriodicalId":162017,"journal":{"name":"2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"System Integration Technology Based on 3D Integration\",\"authors\":\"M. Koyanagi\",\"doi\":\"10.1109/IMFEDK56875.2022.9975417\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A heterogeneous 3D system integration technology is the key technology to achieve future high-performance and energy efficient systems such as high-performance computer system, AI system, post 5G/6G system and quantum computing system. Current status and future prospect of heterogeneous 3D system integration technology are discussed.\",\"PeriodicalId\":162017,\"journal\":{\"name\":\"2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-11-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMFEDK56875.2022.9975417\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMFEDK56875.2022.9975417","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

异构3D系统集成技术是实现高性能计算机系统、人工智能系统、后5G/6G系统、量子计算系统等未来高性能节能系统的关键技术。讨论了异构三维系统集成技术的现状及未来发展前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
System Integration Technology Based on 3D Integration
A heterogeneous 3D system integration technology is the key technology to achieve future high-performance and energy efficient systems such as high-performance computer system, AI system, post 5G/6G system and quantum computing system. Current status and future prospect of heterogeneous 3D system integration technology are discussed.
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