{"title":"钛对Bi42Sn2Ag2Ti(Ce,Ga)合金填充石英玻璃低温活性键合的影响","authors":"Dong Chen, LanXian Cheng, X. Yue, Guoyuan Li","doi":"10.1109/ICEPT50128.2020.9202599","DOIUrl":null,"url":null,"abstract":"Quartz glass is of great technical importance and getting more attractive as a possible candidate for microelectronic packaging substrate or window. In this work, the significant role of active element titanium (Ti) for soldering quartz glass substrates by Bi42Sn2Ag2Ti(Ce,Ga) alloy filler at 170 °C in atmospheric conditions was studied. The time of soldering process was set to be 1, 15, 30, and 60 min, respectively. The microstructures and the dynamic evolution of active element Ti influenced by soldering time were investigated. The glass/solder interface was observed by scanning electron microscopy and the distribution of each element was analyzed by energy dispersive X-ray spectrometry. Results show that the bonding could be achieved by adsorption and segregation of Ti at the interface between quartz glass and active solder. The adsorption and segregation of the Ti element at the quartz glass/solder interface was analyzed theoretically, and the interfacial reaction has been investigated. The understanding of diffusion kinetics of Ti element can further explain the mechanism of active soldering.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Influence of Titanium on Low Temperature Active Bonding of Quartz Glass with Bi42Sn2Ag2Ti(Ce,Ga) Alloy Filler\",\"authors\":\"Dong Chen, LanXian Cheng, X. Yue, Guoyuan Li\",\"doi\":\"10.1109/ICEPT50128.2020.9202599\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Quartz glass is of great technical importance and getting more attractive as a possible candidate for microelectronic packaging substrate or window. In this work, the significant role of active element titanium (Ti) for soldering quartz glass substrates by Bi42Sn2Ag2Ti(Ce,Ga) alloy filler at 170 °C in atmospheric conditions was studied. The time of soldering process was set to be 1, 15, 30, and 60 min, respectively. The microstructures and the dynamic evolution of active element Ti influenced by soldering time were investigated. The glass/solder interface was observed by scanning electron microscopy and the distribution of each element was analyzed by energy dispersive X-ray spectrometry. Results show that the bonding could be achieved by adsorption and segregation of Ti at the interface between quartz glass and active solder. The adsorption and segregation of the Ti element at the quartz glass/solder interface was analyzed theoretically, and the interfacial reaction has been investigated. The understanding of diffusion kinetics of Ti element can further explain the mechanism of active soldering.\",\"PeriodicalId\":136777,\"journal\":{\"name\":\"2020 21st International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"38 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 21st International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT50128.2020.9202599\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT50128.2020.9202599","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Influence of Titanium on Low Temperature Active Bonding of Quartz Glass with Bi42Sn2Ag2Ti(Ce,Ga) Alloy Filler
Quartz glass is of great technical importance and getting more attractive as a possible candidate for microelectronic packaging substrate or window. In this work, the significant role of active element titanium (Ti) for soldering quartz glass substrates by Bi42Sn2Ag2Ti(Ce,Ga) alloy filler at 170 °C in atmospheric conditions was studied. The time of soldering process was set to be 1, 15, 30, and 60 min, respectively. The microstructures and the dynamic evolution of active element Ti influenced by soldering time were investigated. The glass/solder interface was observed by scanning electron microscopy and the distribution of each element was analyzed by energy dispersive X-ray spectrometry. Results show that the bonding could be achieved by adsorption and segregation of Ti at the interface between quartz glass and active solder. The adsorption and segregation of the Ti element at the quartz glass/solder interface was analyzed theoretically, and the interfacial reaction has been investigated. The understanding of diffusion kinetics of Ti element can further explain the mechanism of active soldering.
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