制备长寿命氧化银镉交流触点材料的新工艺

D. Pedder, P. Douglas, J. McCarthy, F. Brugner
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引用次数: 6

摘要

本文介绍了一种新的更通用的内氧化技术,用于制造银镉氧化物接触头。该工艺可以精确控制生产精细均匀的微观结构,避免了触点中心剥落芯的发生,并且使用的氧化时间比传统方法少几个数量级。这种新技术基本上结合了内部氧化和粉末冶金的压实和致密化方法。通过正确控制粉末加工成高密度接触部件的过程,可以从单一粉末中获得广泛的微观结构。该工艺的第一阶段是通过对银和氧化镉粉末混合物进行低温还原和合金化,形成细粒度的银镉合金粉末。这种粉末以球形聚集体的形式生产,为第二步内部氧化做准备。然后在相对较低的温度下对细合金粉末进行内部氧化,所需时间通常比常规内部氧化所需时间短103倍。这导致粉末中含有极细的氧化镉颗粒,与每个粉末颗粒内部和表面的基体具有简单的取向关系。这种内部氧化的合金粉末(IOAP)然后被压实,为烧结和铸造提供绿色压实,以提供高密度的接触尖端。在IOAP工艺的烧结阶段,每个粉末颗粒内的超细氧化镉颗粒通过奥斯特瓦尔德成熟过程生长。这种粗化的程度是由烧结操作的时间和温度以及炉内气氛的氧势决定的:这些参数可以控制,以从非常广泛的可能的微观结构中提供特定的最终材料。铸模操作将密度增加到接近理论值。IOAP工艺还允许在工艺的几个阶段向基础材料中添加选定的元素或化合物,并保留独立于化学成分控制微观结构的能力。IOAP过程的这一特性与更常见的内部氧化技术形成鲜明对比。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
IOAP-A Novel Process for the Manufacture of Long-Life Silver-Cadmium Oxide AC Contact Material
This paper describes a new more versatile internal oxidation technique for the manufacture of silver-cadmium oxide contact tips. The process allows precise control in producing a fine homogeneous microstrueture, it avoids the occurrence of a central denuded core in contacts and uses oxidation times which are several orders of magnitude less than in the conventional method. This novel technique essentially combines internal oxidation and powder metallurgical methods of compaction and densification. By correct control of the processing of the powder into high-density contact parts, a wide range of microstructures may be obtained from a single powder. The first stage of the process is the formation of a silvercadmium alloy powder of fine particle size by the low-temperature reduction and alloying of a silver and cadmium oxide powders mixture. This powder is produced in spherical aggregates in preparation for the second internal oxidation step. Internal oxidation of the fine alloy powder is then carried out at relatively low temperatures in times typically 103 times shorter than are required in conventional internal oxidation. This results in powder which contains extremely fine cadmium oxide particles in a simple orientation relationship with the matrix within and on the surface of each powder particle. This internally oxidized alloy powder (IOAP) is then compacted to provide green compacts for sintering and coining to provide high-density contact tips. During the sintering stage of the IOAP process, the ultrafine cadmium oxide particles within each powder particle grow by an Ostwald ripening process. The extent of this coarsening is governed by the time and temperature of the sintering operation and the oxygen potential of the furnace atmosphere: these parameters can be controlled to provide a specific final material selectable from a very wide range of possible microstructures. The coining operation increases the density to a value approaching the theoretical. The IOAP process also allows the addition of selected elements or compounds to the basic material at several stages in the process and retains the ability to control the microstructure independently from the chemical composition. This feature of the IOAP process is in sharp contrast to more common internal oxidation techniques.
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