铜与氧化物和低钾电介质互连中的漂白效应

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2007-07-11 DOI:10.1109/IPFA.2007.4378059

Yuejin Hou, C. Tan

{"title":"铜与氧化物和低钾电介质互连中的漂白效应","authors":"Yuejin Hou, C. Tan","doi":"10.1109/IPFA.2007.4378059","DOIUrl":null,"url":null,"abstract":"This paper investigates the mechanism of the temperature dependence of the Blech product for both the Cu/oxide and Cu/low-k interconnections. Using finite element modeling (FEM), we demonstrate that Blech product should be temperature dependent at high temperature if the inelastic behavior of Cu is considered. This inelastic behavior has not been taken into consideration in the previous works. The simulated Blech product is found to be consistent with the literature reported values.","PeriodicalId":334987,"journal":{"name":"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Blech Effect in Cu Interconnects with Oxide and Low-k Dielectrics\",\"authors\":\"Yuejin Hou, C. Tan\",\"doi\":\"10.1109/IPFA.2007.4378059\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper investigates the mechanism of the temperature dependence of the Blech product for both the Cu/oxide and Cu/low-k interconnections. Using finite element modeling (FEM), we demonstrate that Blech product should be temperature dependent at high temperature if the inelastic behavior of Cu is considered. This inelastic behavior has not been taken into consideration in the previous works. The simulated Blech product is found to be consistent with the literature reported values.\",\"PeriodicalId\":334987,\"journal\":{\"name\":\"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-07-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2007.4378059\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2007.4378059","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

本文研究了Cu/氧化物和Cu/低钾互连中漂白产物温度依赖性的机理。利用有限元模型(FEM)，我们证明了如果考虑Cu的非弹性行为，在高温下漂白产物应该是温度相关的。这种非弹性行为在以前的工作中没有考虑到。发现模拟的Blech产品与文献报道的值一致。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Blech Effect in Cu Interconnects with Oxide and Low-k Dielectrics

This paper investigates the mechanism of the temperature dependence of the Blech product for both the Cu/oxide and Cu/low-k interconnections. Using finite element modeling (FEM), we demonstrate that Blech product should be temperature dependent at high temperature if the inelastic behavior of Cu is considered. This inelastic behavior has not been taken into consideration in the previous works. The simulated Blech product is found to be consistent with the literature reported values.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits

自引率

0.00%

发文量