基于统计图像处理的扫描声层析成像缺陷检测方法

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564303

K. Sakai, O. Kikuchi, K. Kitami, M. Umeda, Shigeru Ohno

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引用次数: 13

摘要

本文介绍了一种检测复杂晶圆叠层界面键合缺陷的检测技术。该技术检测微小缺陷作为统计异常值从扫描声断层扫描图像，包括重复形成的模式。实验结果表明，超声图像可以检测到复杂图案附近1像素大小的缺陷。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Defect detection method using statistical image processing of scanning acoustic tomography

This paper describes an inspection technique for detecting bonding defects in interfaces of stacked wafers that have complicated patterns. This technique detects the minute defects as statistical outliers from scanning acoustic tomography images that include the pattern formed repeatedly. The experimental results show that one-pixel size defects near the complicated patterns can be detected from ultrasound images.

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2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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